We are seeking an experienced Advanced Packaging & Integration Lead to join our team and develop packaging solutions for multi-chip silicon spin-qubit devices within a scalable quantum system. In this role, you will work with a multidisciplinary team to drive the R&D of complex multi-chip modules utilising TSVs and micro-bumps, optimised for operation at millikelvin temperatures. You will have a significant influence on the physical architecture of next-generation quantum processors, shaping how advanced packaging subsystems integrate into the overall quantum computing solution. Main Duties and Responsibilities • Drive the high-level strategy and architectural design of 3D integrated circuits and multi-chip quantum modules. • Develop advanced packaging solutions using TSVs, fine-pitch micro-bumps, and flip-chip bonding. • Ensure packaging architectures and interconnects can withstand thermal cycling down to the millikelvin regime without delamination or loss of reliability. • Contribute to early-stage architecture and co-design activities, ensuring the advanced packaging subsystem scales with the requirements of the overall quantum system. • Develop simulation approaches to evaluate packaging and process options at DC and RF frequencies, including signal integrity, power integrity, thermal performance, and mechanical stress. • Balance R&D execution with a strong focus on yield improvement, failure analysis, manufacturability, and long-term hardware reliability. • Own relevant technical activities with external suppliers, OSATs, and research partners. • Support the transfer of novel packaging designs into external manufacturing and advanced packaging lines. Experience and Qualifications Required • Master’s or PhD in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related field. • 7+ years’ experience in 3D integration and advanced packaging, including TSVs, fine-pitch micro-bumps, and flip-chip bonding. • Experience with 3D-IC layout, planning, and simulation platforms for multi-die co-design, TSV floorplanning, and vertical interconnect planning. • Experience with multi-physics analysis tools such as Ansys HFSS/Q3D or equivalent for signal/power integrity, RF analysis, and cryogenic structural/thermal stress. • Experience managing technical transfers and working closely with external semiconductor advanced packaging facilities, OSATs, or research partners. • Proven ability to guide technical strategy and work effectively across multidisciplinary engineering teams. Desired • Experience with cryogenic electronics, semiconductor physics, or silicon spin qubits. • Knowledge of material behaviour at extreme temperatures, including superconductors and low-loss dielectrics. • Experience leading or mentoring engineers in a high-tech, fast-paced R&D environment.