<div class="content-intro"><p> </p> <p><strong>Step into a career with ASM, where cutting edge technology meets collaborative culture. </strong></p> <p>For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential. </p></div><p><span data-contrast="auto">As a </span><strong><span data-contrast="auto">Principal Process Engineer</span></strong><span data-contrast="auto"> at ASM, you will leverage semiconductor processing and analytical equipment to research, develop, and optimize advanced thin-film processes enabling next-generation </span><strong><span data-contrast="auto">DRAM and memory technologies</span></strong><span data-contrast="auto">. Your work will focus on Atomic Layer Deposition (ALD, PEALD), Epitaxy, PECVD, oxidation, annealing, and curing processes used in highly scaled memory structures, including capacitors, word lines, bit lines, storage nodes, and advanced memory integration schemes.</span><span data-ccp-props="{}"> </span></p> <p><span data-contrast="auto">You will apply deep technical expertise in memory device fabrication to deliver innovative process solutions that address critical scaling, performance, reliability, and integration challenges. You will design and execute complex experiments, interpret advanced characterization data, and collaborate closely with customers and product teams to accelerate technology development. Technical publications, customer engagement, and the creation of Intellectual Property (IP) are key aspects of this role.</span><span data-ccp-props="{}"> </span></p> <p><span data-ccp-props="{}"> </span></p> <p><strong><span data-contrast="auto">Key Responsibilities</span></strong><span data-ccp-props="{}"> </span></p> <ul> <li data-leveltext="" data-font="Symbol" data-listid="1" data-list-defn-props="{"335552541":1,"335559685":720,"335559991":360,"469769226":"Symbol","469769242":[8226],"469777803":"left","469777804":"","469777815":"multilevel"}" data-aria-posinset="1" data-aria-level="1"><span data-contrast="auto">Develop and optimize advanced deposition processes for DRAM and emerging memory applications utilizing ALD, PEALD, Epitaxy, and PECVD technologies.</span><span data-ccp-props="{}"> </span></li> </ul> <ul> <li data-leveltext="" data-font="Symbol" data-listid="1" data-list-defn-props="{"335552541":1,"335559685":720,"335559991":360,"469769226":"Symbol","469769242":[8226],"469777803":"left","469777804":"","469777815":"multilevel"}" data-aria-posinset="2" data-aria-level="1"><span data-contrast="auto">Drive process innovation for memory-critical films, including high-k dielectrics, capacitor materials, metal electrodes, barrier layers, conductors, and emerging memory materials.</span><span data-ccp-props="{}"> </span></li> </ul> <ul> <li data-leveltext="" data-font="Symbol" data-listid="1" data-list-defn-props="{"335552541":1,"335559685":720,"335559991":360,"469769226":"Symbol","469769242":[8226],"469777803":"left","469777804":"","469777815":"multilevel"}" data-aria-posinset="3" data-aria-level="1"><span data-contrast="auto">Support technology development focused on DRAM scaling challenges such as capacitor formation, buried word lines, advanced patterning, and high-aspect-ratio structures.</span><span data-ccp-props="{}"> </span></li> </ul> <ul> <li data-leveltext="" data-font="Symbol" data-listid="1" data-list-defn-props="{"335552541":1,"335559685":720,"335559991":360,"469769226":"Symbol","469769242":[8226],"469777803":"left","469777804":"","469777815":"multilevel"}" data-aria-posinset="4" data-aria-level="1"><span data-contrast="auto">Remain at the forefront of memory technology trends and roadmaps to identify new process opportunities and technology requirements.</span><span data-ccp-props="{}"> </span></li> </ul> <ul> <li data-leveltext="" data-font="Symbol" data-listid="1" data-list-defn-props="{"335552541":1,"335559685":720,"335559991":360,"469769226":"Symbol","469769242":[8226],"469777803":"left","469777804":"","469777815":"multilevel"}" data-aria-posinset="5" data-aria-level="1"><span data-contrast="auto">Serve as a technical consultant and subject matter expert for internal teams and leading memory manufacturers worldwide.</span><span data-ccp-props="{}"> </span></li> </ul> <ul> <li data-leveltext="" data-font="Symbol" data-listid="1" data-list-defn-props="{"335552541":1,"335559685":720,"335559991":360,"469769226":"Symbol","469769242":[8226],"469777803":"left","469777804":"","469777815":"multilevel"}" data-aria-posinset="6" data-aria-level="1"><span data-contrast="auto">Lead technical problem-solving efforts using scientific methodologies, statistical analysis, and industry-standard tools.</span><span data-ccp-props="{}"> </span></li> </ul> <ul> <li data-leveltext="" data-font="Symbol" data-listid="1" data-list-defn-props="{"335552541":1,"33555